Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069633 | Electronic package | Ming-Fan Tsai, Chih-Hsien Chiu, Tsung-Hsien Tsai, Chao-Ya Yang | 2021-07-20 |
| 10916526 | Method for fabricating electronic package with conductive pillars | Chih-Hsien Chiu, Chih-Chiang He | 2021-02-09 |