Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10893616 | Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board | Hitoshi Onozeki, Tsubasa Inoue, Hiroshi Shimizu | 2021-01-12 |