Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D938925 | Semiconductor device | Ryosuke Okawa, Toshikazu Imai, Kazuma Yoshida, Takeshi Imamura | 2021-12-21 |
| D937232 | Semiconductor device | Ryosuke Okawa, Toshikazu Imai, Kazuma Yoshida, Takeshi Imamura | 2021-11-30 |
| D937233 | Semiconductor device | Ryosuke Okawa, Toshikazu Imai, Kazuma Yoshida, Takeshi Imamura | 2021-11-30 |
| 11171234 | Semiconductor device | Ryosuke Okawa, Toshikazu Imai, Kazuma Yoshida, Takeshi Imamura | 2021-11-09 |
| D934820 | Semiconductor device | Ryosuke Okawa, Toshikazu Imai, Kazuma Yoshida, Takeshi Imamura | 2021-11-02 |
| 11049856 | Semiconductor device | Kazuma Yoshida, Ryosuke Okawa | 2021-06-29 |
| 10893616 | Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board | Hitoshi Onozeki, Katsuji Yamagishi, Hiroshi Shimizu | 2021-01-12 |