Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183458 | Integrated circuit packaging structure and method | Chuan Hu, Junjun Liu, Edward R. Prack | 2021-11-23 |
| 11170863 | Multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAM) | Guobiao ZHANG, Yida Li, Xiaodong Xiang, Hongyu Yu, Shengming Zhou +5 more | 2021-11-09 |
| 10930634 | Integrated circuit system and packaging method therefor | Chuan Hu, Junjun Liu, Edward R. Prack | 2021-02-23 |