Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183458 | Integrated circuit packaging structure and method | Junjun Liu, Yuejin Guo, Edward R. Prack | 2021-11-23 |
| 10930634 | Integrated circuit system and packaging method therefor | Junjun Liu, Yuejin Guo, Edward R. Prack | 2021-02-23 |