Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145581 | Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks | James P. Letterman, Jr. | 2021-10-12 |
| 11049843 | Semiconductor packages | Phillip Celaya, James P. Letterman, Jr., Robert L. Marquis | 2021-06-29 |
| 11037903 | Plasma etch singulated semiconductor packages and related methods | — | 2021-06-15 |