Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164805 | Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon | Taewon Yoo | 2021-11-02 |
YK
Younglyong Kim
Overall (2021): #199,638 of 548,734Top 40%
1
Patents 2021