Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164805 | Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon | Younglyong Kim | 2021-11-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164805 | Semiconductor package including non-conductive film between package substrate and semiconductor chip thereon | Younglyong Kim | 2021-11-02 |