Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957647 | Integrated circuit devices including a boron-containing insulating pattern | Dong-kak Lee, Mong-Sup Lee, Wook-Yeol Yi | 2021-03-23 |
| 10916549 | Semiconductor devices including enlarged contact hole and methods of forming the same | Jae Uk Shin, Yong-Sun Ko, Im-Soo Park, Sung-Yoon Chung | 2021-02-09 |