Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049827 | Semiconductor devices including a thick metal layer and a bump | Minjung Choi, Sooho Shin, Junghoon Han | 2021-06-29 |
YL
Yeonjin Lee
Overall (2021): #203,413 of 548,734Top 40%
1
Patents 2021