Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049827 | Semiconductor devices including a thick metal layer and a bump | Sooho Shin, Yeonjin Lee, Junghoon Han | 2021-06-29 |
MC
Minjung Choi
Overall (2021): #335,295 of 548,734Top 65%
1
Patents 2021