Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114397 | Semiconductor package substrate and method of manufacturing semiconductor package using the same | Dae Hee Lee, Hyun Chul Jung, Myeong-Ho Hong | 2021-09-07 |
TK
Tae Ho Ko
Overall (2021): #241,966 of 548,734Top 45%
1
Patents 2021