Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114397 | Semiconductor package substrate and method of manufacturing semiconductor package using the same | Tae Ho Ko, Dae Hee Lee, Myeong-Ho Hong | 2021-09-07 |
HJ
Hyun Chul Jung
Overall (2021): #427,232 of 548,734Top 80%
1
Patents 2021