Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11191150 | Electronic component module and method for manufacturing the same | Hong-seok Lee, Gye Won Lee, Hee Sun Oh, Jong Yun Kim, Chang Ju LEE | 2021-11-30 |
| 10934431 | Polycarbonate resin composition having excellent heat resistance and fluidity, and molded product including same | Jung Up Park, Jin Sik CHOI, Seong Hyen HEO, Kyung Moo Shin | 2021-03-02 |