Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11191150 | Electronic component module and method for manufacturing the same | Hong-seok Lee, Gye Won Lee, Jong Yun Kim, Seung Pil JUNG, Chang Ju LEE | 2021-11-30 |
| 10999957 | Communication module and mounting structure thereof | Gye Won Lee, Nam Gyun Yim, Eun Bae PARK, Hong-seok Lee, Jong Yun Kim +3 more | 2021-05-04 |