Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930610 | Semiconductor chip including a bump structure and semiconductor package including the same | Hyun-Soo Chung, Han-Sung Ryu, In-Young Lee, Chan-Ho Lee | 2021-02-23 |
JB
Jin-Kuk Bae
Overall (2021): #407,071 of 548,734Top 75%
1
Patents 2021