Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10930610 | Semiconductor chip including a bump structure and semiconductor package including the same | Jin-Kuk Bae, Hyun-Soo Chung, In-Young Lee, Chan-Ho Lee | 2021-02-23 |
HR
Han-Sung Ryu
Overall (2021): #439,046 of 548,734Top 85%
1
Patents 2021