Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10887980 | Coupled via structure, circuit board having the coupled via structure and method of manufacturing the circuit board | Dong-Yoon Seo, Wansoo Nah | 2021-01-05 |
JL
Jea-Eun Lee
Research & Business Foundation Sungkyunkwan University: 1 patents #47 of 282Top 20%
Overall (2021): #410,150 of 548,734Top 75%
1
Patents 2021