Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10887980 | Coupled via structure, circuit board having the coupled via structure and method of manufacturing the circuit board | Jea-Eun Lee, Wansoo Nah | 2021-01-05 |
DS
Dong-Yoon Seo
Research & Business Foundation Sungkyunkwan University: 1 patents #47 of 282Top 20%
Overall (2021): #470,189 of 548,734Top 90%
1
Patents 2021