Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094663 | Method for transient liquid-phase bonding between metal materials using a magnetic force | Seung Boo Jung, Kyung Deuk MIN, Kwang-Ho Jung, Hak San Jeong, Jae Ha Kim +1 more | 2021-08-17 |