Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094663 | Method for transient liquid-phase bonding between metal materials using a magnetic force | Kyung Deuk MIN, Kwang-Ho Jung, Choong-Jae Lee, Hak San Jeong, Jae Ha Kim +1 more | 2021-08-17 |
| RE48421 | Flip chip and method of making flip chip | Jong Woong KIM | 2021-02-02 |
| RE48422 | Method of making flip chip | Jong Woong KIM | 2021-02-02 |