Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127685 | Power semiconductor module with dimples in metallization layer below foot of terminal | Milad MALEKI, Dominik Trüssel, Remi-Alain Guillemin, Daniel Schneider | 2021-09-21 |
| 11065809 | Apparatus and method for producing a three- dimensional object built up from at least one material layer | Julian Koopmann, Knut Schmidt | 2021-07-20 |
| 11031323 | Interconnecting member for power module | Samuel Hartmann, Dominik Truessel | 2021-06-08 |
| 11009888 | Autonomous vehicle and marking arrangement for an autonomous vehicle | Bastian Steder, Thomas E. Bludau | 2021-05-18 |
| 10919284 | Method for stiffening metal components by means of a robot-controlled application head | Robert D. Thomas, Max Ehleben, Thomas Mertens, Anselm Tobias Bochtler | 2021-02-16 |