Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127685 | Power semiconductor module with dimples in metallization layer below foot of terminal | Fabian Fischer, Dominik Trüssel, Remi-Alain Guillemin, Daniel Schneider | 2021-09-21 |