Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916494 | Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction | Yuan LI, Shrestha Ganguly, Terence Cheung, Ching-Liou Huang, Hui Wang | 2021-02-09 |