Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10916494 | Device comprising first solder interconnects aligned in a first direction and second solder interconnects aligned in a second direction | Abdolreza Langari, Yuan LI, Shrestha Ganguly, Ching-Liou Huang, Hui Wang | 2021-02-09 | $42,173,000 |