Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950557 | Stacked chip package structure and manufacturing method thereof | Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu, Chun-Te Lin | 2021-03-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950557 | Stacked chip package structure and manufacturing method thereof | Li-Chih Fang, Ji-Cheng Lin, Che-Min Chu, Chun-Te Lin | 2021-03-16 |