Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950557 | Stacked chip package structure and manufacturing method thereof | Li-Chih Fang, Ji-Cheng Lin, Chun-Te Lin, Chien-Wen Huang | 2021-03-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950557 | Stacked chip package structure and manufacturing method thereof | Li-Chih Fang, Ji-Cheng Lin, Chun-Te Lin, Chien-Wen Huang | 2021-03-16 |