Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943882 | IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures | Jayprakash Chipalkatti, Zuhair Bokharey, Don Templeton, Brian Schieck, Julie Lam | 2021-03-09 |