Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11128268 | Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof | Jaynal A. Molla, Lakshminarayan Viswanathan, Tianwei Sun, David J. Dougherty | 2021-09-21 |