Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11128268 | Power amplifier packages containing peripherally-encapsulated dies and methods for the fabrication thereof | Sharan Kishore, Lakshminarayan Viswanathan, Tianwei Sun, David J. Dougherty | 2021-09-21 |
| 10923451 | Semiconductor dies having ultra-thin wafer backmetal systems, microelectronic devices containing the same, and associated fabrication methods | Tianwei Sun | 2021-02-16 |