Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11050407 | Electronic devices formed in a cavity between substrates | — | 2021-06-29 |
| 10999932 | Electronic package including cavity defined by resin and method of forming same | Mitsuhiro Furukawa, Ichiro Kameyama, Tetsuya Uebayashi | 2021-05-04 |
| 10965269 | Electronic devices formed in a cavity between substrates and including a via | — | 2021-03-30 |