Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10999932 | Electronic package including cavity defined by resin and method of forming same | Atsushi Takano, Ichiro Kameyama, Tetsuya Uebayashi | 2021-05-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10999932 | Electronic package including cavity defined by resin and method of forming same | Atsushi Takano, Ichiro Kameyama, Tetsuya Uebayashi | 2021-05-04 |