PH

Ping Huang

CM Cmc Materials: 1 patents #7 of 28Top 25%
Huawei: 1 patents #1,264 of 3,447Top 40%
Overall (2021): #122,428 of 548,734Top 25%
2
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11159363 Fault localization method and device Xin Xiao, Li Xue, Ruihong Wang, Qiang Wang 2021-10-26
10946495 Low density polishing pad William C. Allison, Richard L. Frentzel, Paul Andre Lefevre, Robert Kerprich, Diane Scott 2021-03-16