Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107807 | IC package having a metal die for ESP protection | Fang-Wen Liu | 2021-08-31 |
| 11094692 | Semiconductor structure having active regions with different dopant concentrations | Ching-Chia Huang | 2021-08-17 |
| 11037921 | Off chip driver structure | Fang-Wen Liu | 2021-06-15 |
| 10937886 | Semiconductor device with negative capacitance material in buried channel | Ching-Chia Huang, Wei-Ming Liao | 2021-03-02 |
| 10903080 | Transistor device and method for preparing the same | Jhen-Yu Tsai, Wei-Ming Liao | 2021-01-26 |