Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107807 | IC package having a metal die for ESP protection | Tseng-Fu Lu | 2021-08-31 |
| 11101501 | Electrolyte and negative electrode structure | Qiangfeng Xiao, Yunfeng Lu, Mei Cai, Fang Dai, Li Yang | 2021-08-24 |
| 11037921 | Off chip driver structure | Tseng-Fu Lu | 2021-06-15 |