Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205607 | Semiconductor structure and method of manufacturing thereof | Chiang-Lin Shih, Hsih-Yang Chiu, Pei-Jhen Wu | 2021-12-21 |
| 11063003 | Semiconductor device with diced semiconductor chips and method for manufacturing the same | Hsih-Yang Chiu | 2021-07-13 |
| 10910345 | Semiconductor device with stacked die device | Chiang-Lin Shih, Pei-Jhen Wu, Hsih-Yang Chiu | 2021-02-02 |