Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121123 | Semiconductor composite device and package board used therein | Koshi HIMEDA, Tatsuya Kitamura, Chiharu Sakaki, Sho Fujita, Atsushi Yamamoto +4 more | 2021-09-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121123 | Semiconductor composite device and package board used therein | Koshi HIMEDA, Tatsuya Kitamura, Chiharu Sakaki, Sho Fujita, Atsushi Yamamoto +4 more | 2021-09-14 |