Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145607 | Semiconductor chip | Yusuke Tanaka, Fumio Harima, Masayuki Aoike | 2021-10-12 |
| 11121123 | Semiconductor composite device and package board used therein | Tatsuya Kitamura, Chiharu Sakaki, Shinya Kiyono, Sho Fujita, Atsushi Yamamoto +4 more | 2021-09-14 |