Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11089680 | Multilayer substrate, interposer, and electronic device | Hiromasa KOYAMA, Atsushi Kasuya | 2021-08-10 |
| 11001042 | Method of manufacturing treated sheet and method of manufacturing resin multilayer substrate | Hiroyuki Ohata | 2021-05-11 |
| 10959327 | Multilayer wiring substrate | Shinichi Araki, Hideyuki Taguchi, Hayato Noma | 2021-03-23 |