Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11102885 | Resin multilayer substrate and electronic device | Yusuke Kamitsubo | 2021-08-24 |
| 11096282 | Substrate bonding structure | — | 2021-08-17 |
| 11089680 | Multilayer substrate, interposer, and electronic device | Hiromasa KOYAMA, Ryosuke TAKADA | 2021-08-10 |