Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11209735 | Composition for forming metal-containing film, method of producing composition for forming metal-containing film, semiconductor device, and method of producing semiconductor device | Yasuhisa Kayaba, Hirofumi Tanaka | 2021-12-28 |
| 10950532 | Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method | Yasuhisa Kayaba, Hirofumi Tanaka, Koji Inoue, Hiroko Wachi | 2021-03-16 |