Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950532 | Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method | Yasuhisa Kayaba, Shoko Ono, Hirofumi Tanaka, Koji Inoue | 2021-03-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950532 | Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method | Yasuhisa Kayaba, Shoko Ono, Hirofumi Tanaka, Koji Inoue | 2021-03-16 |