Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11062974 | Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate | Nobuyuki Terasaki | 2021-07-13 |
| 11013107 | Insulated circuit board | Takeshi Kitahara, Ryohei Yumoto | 2021-05-18 |