Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177186 | Bonded body and insulated circuit board | — | 2021-11-16 |
| 11094606 | Bonded body, insulated circuit board with heat sink, and heat sink | — | 2021-08-17 |
| 11062974 | Bonded body, power module substrate, method for manufacturing bonded body, and method for manufacturing power module substrate | Yoshiyuki Nagatomo | 2021-07-13 |
| 11028022 | Copper-ceramic bonded body and insulation circuit substrate | — | 2021-06-08 |
| 10998250 | Bonded body and insulating circuit substrate | — | 2021-05-04 |