Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004761 | Packaging of a semiconductor device with dual sealing materials | Junji Fujino, Hiroshi Kawashima, Taketoshi MAEDA | 2021-05-11 |
SS
Soichi Sakamoto
Overall (2021): #255,040 of 548,734Top 50%
1
Patents 2021