Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183479 | Semiconductor device, method for manufacturing the same, and power conversion device | Shohei Ogawa, Isao Oshima, Satoru Ishikawa, Takumi Shigemoto | 2021-11-23 |
| 11004761 | Packaging of a semiconductor device with dual sealing materials | Soichi Sakamoto, Hiroshi Kawashima, Taketoshi MAEDA | 2021-05-11 |
| 10978366 | Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module | Yuji IMOTO, Shohei Ogawa, Mikio Ishihara | 2021-04-13 |