Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11211364 | Semiconductor device assemblies and systems with improved thermal performance and methods for making the same | Hyunsuk Chun | 2021-12-28 | $20,140,000 |
| 11011449 | Apparatus and method for dissipating heat in multiple semiconductor device modules | Shams U. Arifeen | 2021-05-18 | $21,936,000 |
| 11011452 | Heat spreaders for semiconductor devices, and associated systems and methods | Amy R. Griffin, Hyunsuk Chun | 2021-05-18 | $21,936,000 |
| 10952352 | Assemblies including heat dispersing elements and related systems and methods | — | 2021-03-16 | $22,312,000 |