Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164837 | Semiconductor device packages with angled pillars for decreasing stress | — | 2021-11-02 |
| 11031353 | Warpage control in microelectronic packages, and related assemblies and methods | Christopher Glancey | 2021-06-08 |
| 11011449 | Apparatus and method for dissipating heat in multiple semiconductor device modules | Xiaopeng Qu | 2021-05-18 |