Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107795 | Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture | Nathan Joseph Sirocka, Andrew D. Proescholdt | 2021-08-31 |
| 11092990 | Apparatuses and related methods for staggering power-up of a stack of semiconductor dies | — | 2021-08-17 |