Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107795 | Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture | Nathan Joseph Sirocka, Trismardawi Tanadi | 2021-08-31 |
| 10949300 | Error correction code event detection | Yihua Zhang, Paolo E. Mangalindan, Jianfei Lei, Gerard A. Kreifels | 2021-03-16 |